Techsil Provides New Thermal Management Solutions

Techsil Provides New Thermal Management Solutions from Techsil

By: Techsil  16/06/2014
Keywords: Thermal Management, silicone for electronics, Thermally Conductive Silicone,

Today’s electronics are smaller and more powerful than ever, leading to ever increasing thermal challenges for the systems designer. While fans, heat sinks, liquid cooling and thermoelectric devices can be used to provide enough cooling power the problem still remains - how to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better heat dissipation and cooling. Techsil introduces 2 new one-component thermal interface materials to the market, striving to find solutions to aid your thermal management. Techsil TIM11021 is a 1-part grey paste silicone non-curing compound that provides high thermal conductivity with low bleed and minimal weight loss at elevated temperatures; successfully operating at a wide temperature range of -40°C to 150°C with a thermal conductivity of ~2.1 W/m K. TIM11021 is designed to withstand hydraulic ‘pump out’ caused by thermal cycling. It has minimal ionic impurities and is used across a range of industries: - Thermal Management: - Aerospace & Aviation - Automotive Electronics - Healthcare Electronics - Semiconductor Packaging (Microelectronics) - Energy, Power & Utilities - Power Supplies - Electronics for Hybrid Engine Parts (Automotive) - Microelectronics Board Assembly - Consumer Electronics - Flat Panel Displays - Telecommunications Techsil TIM11123 (GB) is a self-gapping, non-corrosive, 1-part, room temperature vulcanising (RTV) silicone rubber. TIM11123 cures rapidly in contact with atmospheric moisture to a tough rubber that exhibits an excellent thermal conductive property of ~2.3 W/m K. TIM11123 (GB) does not corrode copper or its alloys and offers excellent primerless adhesion to many substrates when fully cured. It has been designed to be flowable and contains 200 micron glass beads to control bond line thickness. Adhesive TIM11123 (GB) presents good spreading and tooling properties with low linear shrinkage and fast skinning. It will cure through 2 to 3mm in less than 24 hours and its adhesion to most substrates improves with age until most are cohesive. Both TIM11021 & TIM11123 (GB) are supplied ready to use in 310ml cartridges, no mixing is required reducing wastage and making the product very easy to apply. They can be dispensed using either manual or pneumatic dispensers. For more information on either product, you can contact the Techsil Technical Team direct: Email: [email protected] Tel: 01789 773232

Keywords: silicone for electronics, Thermal Management, Thermally Conductive Silicone,

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