Device and component encapsulation
Teledyne Impulse-PDM Ltd
Specialist encapsulation techniques developed by PDM Neptec Ltd enable the encapsulation of PCBs and other assemblies for mechanical protection and prevention of moisture ingress.
Products can be encapsulated under vacuum or pressure, open cast or moulded in custom designed tolling, to suit the application.
Whatever the medium or method, PDM Neptec Ltd can ensure that potted assemblies are void-free and impermable to the surrounding environment.
PDM Neptec Ltd have a long history of encapsualtion and moulding of acoustically transparent materials used in high-reliability applications.