Goodbye to stencils and
hello to Solder Jet Printing Technology.
With over 80% of PCB assembly errors as a
direct result of solder paste application, the MY500 provides the solution.
Using revolutionary technology the MY500 jets paste on the fly, at 1.8 million
dots per hour. A technology suited to higher density assemblies with BGA
The MY500 is a stencil free process that
eliminates many typical problems such as missing paste deposits and incorrect
paste volume with such problems leading to poor quality products.
There is no longer a need to order or
handle stencils, minimizing the cost of time and materials. Tooling is
completed direct from CAD data. As no stencils are required, it also eliminates
the need for harsh cleaning, damaging to both employees and the environment.
Solder Jet printing can apply solder paste
dots small enough to reflow the finest available mainstream components such as
0.4 mm pitch, Micro BGA, DFN and QFN to IPC SM-782A requirements.
Gemini Tec use a MY500 stencil free
printer, Sales Director Adam Harsant comments;
‘Our decision to invest in stencil free printing was perfectly timed to
meet market conditions. We are
delivering a higher level of technical capability for complex assembly and
providing a real commercial advantage.’
Lead-free & Leaded Compatible
Operators switch from leaded to lead-free
solder paste within seconds. This process virtually eliminates waste. Cassette
calibration ensures the correct viscosity of paste, leading to higher levels of
Process Control for SMT assemblyOperators
can only run print programs approved for production, and can easily be adjusted
off-line. Solder paste can be placed in three dimensions to achieve the correct
volume, with deposits as close as 0.2 mm.