PCB Assembly for PoP technology - Package-On-Package

PCB Assembly for PoP technology - Package-On-Package from Gemini Tec

By: Gemini Tec  29/07/2014
Keywords: PCB assembly, Electronics Manufacturing, Surface Mount

The demand to design and build products using (Package on Package) is increasing for products, such as mobile communications, PDA, tablet and camera based technology.

From our leading edge production facility based in Aldershot UK, Gemini Tec provide a PCB assembly service to cater for package-on-package (PoP) and a range of technology devices. We are the only UK manufacture to use two state-of-the-art solder jet printers, offering our customers direct access to this manufacturing technology at competetive price points.

Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two packages are installed on top of each other, i.e. stacked, with a standard interface to route signals between them. This allows a much higher component density on PCB design to be used.

Electrically, PoP offers benefits by minimising track length between different interoperating parts, such as a controller and a memory. This yields better electrical performance of devices, since shorter routing of interconnections between circuits yields faster signal propagation and reduced noise and cross-talk.

Using our MYCRONIC solder jet printers, with thier highly controlled Z-height paste control, solder paste deposits can be printed to both PCB’s and ASICC logic dies during the same manufacturing cycle. Our highly flexible MYCRONIC chip placers can accurately place stacked memory dies to form the BGA PoP assembly.

Our facility uses fully automated PCB handling to mirror large-scale volume assembly techniques. And in addition to creating a a bespoke thermal profile to suit the product, we provide additional process validation using X-ray, ERSA optical camera inspection, X J-tag and AOI inspection. We provide manufacturing services for package-on-package BGA assembly (PoP devices) for rapid prototype to medium batch production orders. Our service is suitable for a wide variety of products such as; niche applications of 1-1000 batch sizes, short product life cycles, development boards and NPI prior to mass volume manufacture. If you are considering the use of PoP (Package-on-Package) technology, contact us for more assistance. We provide a full turnkey service from PCB design to full production, backed with over 36 years of industry experience. Tel +44 (0) 1252 333 444

Keywords: Contract Electronics, Electronics Manufacturing, PCB assembly, Printed Circuit Board Assembly, SMT assembly, Surface Mount, Surface Mount Assembly, surface mount technology

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