X-ray and CSAM imaging of packages

By: NanoScope Services Ltd  02/03/2011
Keywords: Circuit Edit, Failure And Process Analysis, FIB analysis,

Non-destructive analysis of die inside the plastic package - look for die attach, packaging or bonding issues before opening.

Keywords: Circuit Edit, Failure And Process Analysis, FIB analysis, Plastic Package Decapsulation, Xray and CSAM,

Other products and services from NanoScope Services Ltd

Circuit Edit from NanoScope Services Ltd thumbnail
09/01/2013

Circuit Edit

Your 1st Silicon Emergency Service - rapid circuit edit with high sucees rates to your shorten time to market


02/03/2011

Package decap and resealing

Open plastic IC's for direct interventions and anlysis, and close them after modification for board level test ad attachment.


02/03/2011

TEM sample preparation and Extraction

Prepare a TEM foil from a specific location and extract it to TEM grid without significant damage to your bulk


02/03/2011

Circuit Edit, Device Modification

Direct rewiring of fabricated IC's for proving mask changes before commiting to them - 1st time right!