NanoScope Services Ltd
process control, Failure Analysis, TEM analysis
Prepare a TEM foil from a specific location and extract it to TEM grid without significant damage to your bulk sample. Material and structure independant.
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Your 1st Silicon Emergency Service - rapid circuit edit with high sucees rates to your shorten time to market
Non-destructive analysis of die inside the plastic package - look for die attach, packaging or bonding issues before opening.
Open plastic IC's for direct interventions and anlysis, and close them after modification for board level test ad attachment.
Direct rewiring of fabricated IC's for proving mask changes before commiting to them - 1st time right!
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